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Your StrategicValue-Added PartnerEstablished in 2008, DSK Technologies Pte Ltd is a youthful, dynamic and fast-growing company. -
ONE-STOPSOURCING SOLUTION AGENTOur mission is to establish DSK as the preferred Business Partner.
Our Products
This Dicing Tape is designed for Blade Dicing and Laser Dicing ProcessView Details
Hubless Blade for Package SawView Details
Wafer Back Grinding Tape Designed for Semiconductor Wafer. It has outstanding characteristics support the backgrind process of wafer manufacturing. Twotypes of Back Grinding Tape are available: UV curable type, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type. View Details
Lead Frame Backside tape is used in molding process for QFN packageView Details
DSK Technologies provide dicing services on wafer with various diameters on both patterned and non-patterned substrates. Quality and precision are crucial in silicon and semiconductor wafer dicing service. DSK ensures precision through each wafer dicing stage. It translates to cleaner wafers, less distortions and material loss reduction. We accommodate special request, such as assembling the diced dies into packages or leaving them on tape for future assembly activity. DSK Technologies provides global customers with customized precision of wafer dicing services. Contact us for wafer dicing support. View Details
Sputtering Targets and Evaporation MaterialsView Details
Etched Lead FrameView Details
Thermal release tape adheres tightly at normal temperature, yet can be peeled off effortlessly when necessary by heating it. It is useful for various applications in semiconductor and electronics as well as various temporary fixing. The pressure sensitive adhesive is composed of a layer of adhesive on a substrate which reduces peeling force when heated to a certain temperature. With no residue left after removal, no clean-up is needed. The tape contributes significantly to automation during various electronic component manufacturing processes. DSK Technologies customizes various thermal release tapes for your needs. View Details
CleanDice is designed specifically for the semiconductor industry. View Details
Rubber clean & wax sheet are rubber-bases mold cleaner & conditioner that are developed as companion products of encapsulate materials [EMC] for semiconductor device.View Details
Rubber clean & wax sheet are rubber-bases mold cleaner & conditioner that are developed as companion products of encapsulate materials [EMC] for semiconductor device.View Details
