

Our Products

This Dicing Tape is designed for Blade Dicing and Laser Dicing ProcessView Details

Hubless Blade for Package SawView Details

Wafer Back Grinding Tape Designed for Semiconductor Wafer. It has outstanding characteristics support the backgrind process of wafer manufacturing. Twotypes of Back Grinding Tape are available: UV curable type, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type. View Details

Lead Frame Backside tape is used in molding process for QFN packageView Details

Silicon Test WaferView Details

Sputtering Targets and Evaporation MaterialsView Details

Etched Lead FrameView Details

Thermal release tape is deisgned for various purposes such as semiconductor and electronics.View Details

CleanDice is designed specifically for the semiconductor industry. View Details

Rubber clean & wax sheet are rubber-bases mold cleaner & conditioner that are developed as companion products of encapsulate materials [EMC] for semiconductor device.View Details

Rubber clean & wax sheet are rubber-bases mold cleaner & conditioner that are developed as companion products of encapsulate materials [EMC] for semiconductor device.View Details