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Your StrategicValue-Added PartnerEstablished in 2008, DSK Technologies Pte Ltd is a youthful, dynamic and fast-growing company. -
ONE-STOPSOURCING SOLUTION AGENTOur mission is to establish DSK as the preferred Business Partner.
Our Products
This Dicing Tape is designed for Blade Dicing and Laser Dicing ProcessView Details
Hubless Blade for Package SawView Details
Wafer Back Grinding Tape Designed for Semiconductor Wafer. It has outstanding characteristics support the backgrind process of wafer manufacturing. Twotypes of Back Grinding Tape are available: UV curable type, which achieves easier peeling after reducing adhesion by UV irradiation, and non-UV type. View Details
Lead Frame Backside tape is used in molding process for QFN packageView Details
DSK Technologies offer our clients dicing services on wafer diameters ranging from 50mm to 300mm on both patterned and non-patterned substrates. It is also optional to assemble the diced dies into packages or even leave them on tape for future assembly activity.View Details
Sputtering Targets and Evaporation MaterialsView Details
Etched Lead FrameView Details
Thermal release tape is deisgned for various purposes such as semiconductor and electronics.View Details
CleanDice is designed specifically for the semiconductor industry. View Details
Rubber clean & wax sheet are rubber-bases mold cleaner & conditioner that are developed as companion products of encapsulate materials [EMC] for semiconductor device.View Details
Rubber clean & wax sheet are rubber-bases mold cleaner & conditioner that are developed as companion products of encapsulate materials [EMC] for semiconductor device.View Details
